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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Electrochemical corrosion behaviour of Sn-Sb solder alloys: the roles of alloy Sb content and type of intermetallic compound

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Author(s):
Dias, Marcelino [1] ; Verissimo, Nathalia C. [1] ; Regone, Natal N. [2] ; Freitas, Emmanuelle S. [3] ; Cheung, Noe [1] ; Garcia, Amauri [1]
Total Authors: 6
Affiliation:
[1] Univ Estadual Campinas, Dept Mfg & Mat Engn, Campinas, SP - Brazil
[2] Sao Paulo State Univ, Campus Sao Joao da Boa Vista, Sao Joao Da Boa Vista - Brazil
[3] Univ Fed Sao Paulo, Marine Inst, Santos, SP - Brazil
Total Affiliations: 3
Document type: Journal article
Source: CORROSION ENGINEERING SCIENCE AND TECHNOLOGY; JUL 2020.
Web of Science Citations: 0
Abstract

Sn-Sb solder alloys (2; 5.5 and 10wt-% Sb) were directionally solidified with a view to permitting the effect of a wide range of solidification cooling rates to be related to the resulting microstructure, which is shown to be formed by a cellular Sn-rich matrix with Sn-Sb intermetallic particles (IMCs) randomly distributed in the matrix The corrosion resistance of these alloys is investigated by electrochemical impedance spectroscopy (EIS), equivalent circuit and linear polarisation and the results correlated with microstructural features. The increase in the alloy Sb content is shown to change the nature/morphology of the Sn-Sb IMCs, consequently affecting the corrosion resistance. The EIS data indicated that the Sn-10wt-%Sb alloy has the best corrosion resistance because of the high resistance of its oxide barrier layer. The polarisation curves also indicate lowest corrosion rate and nobler potential related to the Sn-10wt-%Sb alloy, which has also been confirmed by calculations of polarisation resistance. (AU)

FAPESP's process: 18/11791-2 - Microstructural Evolution and Mechanical and Wear Resistances of Ternary Al-Bi-Si and Al-Bi-Ni alloys Unidirectionally Solidified
Grantee:José Marcelino da Silva Dias Filho
Support Opportunities: Scholarships abroad - Research Internship - Post-doctor
FAPESP's process: 17/15158-0 - Characterization of microstructure and properties in the evaluation of alloys for thermal interface contact
Grantee:Amauri Garcia
Support Opportunities: Regular Research Grants