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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Microstructural development of hypoeutectic Zn-(10-40)wt%Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness

Full text
Author(s):
Santos, Washington L. R. [1] ; Brito, Crystopher [1] ; Bertelli, Felipe [1] ; Spinelli, Jose E. [2] ; Garcia, Amauri [1]
Total Authors: 5
Affiliation:
[1] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, BR-13083970 Campinas, SP - Brazil
[2] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Paulo - Brazil
Total Affiliations: 2
Document type: Journal article
Source: Journal of Alloys and Compounds; v. 647, p. 989-996, OCT 25 2015.
Web of Science Citations: 13
Abstract

The most relevant range of compositions of Zn-Sn high-temperature solder alloys remains between 10 and 40 wt%Sn. Hence, transient directional solidification experiments have been carried out with Zn-10, 20, 30 and 40wt%Sn alloys under a wide range of cooling rates ((T) over dot) with a view to investigating the corresponding microstructural evolution. The microstructure is shown to be formed mainly by an alternation of Zn-rich plate-like cells and a eutectic mixture. Morphological instabilities of the Zn-rich plates are shown to start for the lower content Zn-10 and 20wt%Sn alloys, however a microstructural transition of these plates into cylindrical-type horizontal cells can only be found in the microstructure of the 30 and 40wt%Sn alloys. Experimental growth laws are proposed relating the microstructural spacing (lambda) to solidification thermal parameters. Hardness (HV) is shown be affected by both the positive segregation of Sn, the alloy volumetric fraction of Zn and lambda. Hall-Petch type equations are proposed relating HV to lambda. (C) 2015 Elsevier B.V. All rights reserved. (AU)

FAPESP's process: 13/13030-5 - Microstructure, thermal parameters, segregation and mechanical properties of lead-free Sn-based, Zn-based and Bi-based solder alloys
Grantee:José Eduardo Spinelli
Support type: Regular Research Grants
FAPESP's process: 12/08494-0 - Thermal and Microstructural Parameters in the Transient Solidification of Al-Mg and Al-Mg-Si Alloys and Correlation with Mechanical and Corrosion Resistances
Grantee:Crystopher Cardoso de Brito
Support type: Scholarships in Brazil - Doctorate
FAPESP's process: 12/16328-2 - The Correlation between Solidification Microstructures and Mechanical and Tribological Properties of Al-Sn-Cu and Al-Sn-Si Alloys
Grantee:Felipe Bertelli
Support type: Scholarships in Brazil - Post-Doctorate