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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Evaluation of solder/substrate thermal conductance and wetting angle of Sn-0.7 wt%Cu-(0-0.1 wt%Ni) solder alloys

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Author(s):
Silva, Bismarck Luiz [1] ; Cheung, Noe [2] ; Garcia, Amauri [2] ; Spinelli, Jose Eduardo [1]
Total Authors: 4
Affiliation:
[1] Univ Fed Sao Carlos, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
[2] Univ Estadual Campinas, Dept Mfg & Mat Engn, BR-13083970 Campinas, SP - Brazil
Total Affiliations: 2
Document type: Journal article
Source: Materials Letters; v. 142, p. 163-167, MAR 1 2015.
Web of Science Citations: 20
Abstract

Wettability is defined as the tendency of a liquid metal to spread on a solid surface. The solder/substrate thermal conductance represented by a heat transfer coefficient, h(i), states the heat ability to flow across the solder/substrate interface during solidification, being affected by the wettability. This letter aims to investigate the wetting behavior of Sn-0.7 wt%Cu-(Ni) lead-free solders by measuring the contact angles (theta) on a copper substrate as a function of the alloy Ni content. Furthermore, time-dependent h(i) profiles are determined from thermal readings during directional solidification (DS) of Sn-0.7 wt%Cu-(xNi) alloys. It is shown that a smaller initial contact angle (theta(i)=32.7) characterizes the Sn-0.7 wt%Cu-0.05 wt%Ni associated with the highest h(i) value of 11,500t(-032.7) w/m(2) K A (t: time). (C) 2014 Elsevier B.V. All rights reserved. (AU)

FAPESP's process: 13/08259-3 - Microstructure and mechanical behavior of Sn-Bi-Cu and Sn-Bi-Ag lead-free solder alloys
Grantee:Bismarck Luiz Silva
Support type: Scholarships in Brazil - Doctorate
FAPESP's process: 13/13030-5 - Microstructure, thermal parameters, segregation and mechanical properties of lead-free Sn-based, Zn-based and Bi-based solder alloys
Grantee:José Eduardo Spinelli
Support type: Regular Research Grants