Scholarship 23/00822-2 - Análise numérica, Otimização topológica - BV FAPESP
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Multimaterial topology optimization for additive manufacturing

Grant number: 23/00822-2
Support Opportunities:Scholarships abroad - Research Internship - Post-doctor
Start date until: July 29, 2023
End date until: July 26, 2024
Field of knowledge:Physical Sciences and Mathematics - Mathematics - Applied Mathematics
Principal Investigator:Maicon Ribeiro Correa
Grantee:Geovane Augusto Haveroth
Supervisor: Carl-Johan Thore
Host Institution: Instituto de Matemática, Estatística e Computação Científica (IMECC). Universidade Estadual de Campinas (UNICAMP). Campinas , SP, Brazil
Institution abroad: Linköping University (LiU), Sweden  
Associated to the scholarship:20/14288-0 - Topology optimization for additive manufacturing, BP.PD

Abstract

The purpose of this research project is to present and develop a theoretical and computational framework for multimaterial topological optimization (TO) of mechanical components and external supports produced by additive manufacturing (AM). The essential feature of the standard formulation in TO is that this fabrication process, carried out layer by layer, is included as a series of state problems in addition to the state problem of the final product. The mathematical problem - the archetype problem - was recently established in the literature for TO applications for the AM process of mechanical components without the inclusion of simultaneous TO for supports. To include them, we must use a multiphysics approach involving temperature, displacement and fluid flow both in the final and partially fabricated components and in the supports to be included. Objective functions proper to the problem must be proposed and verified. The computational complexity involved in multi-physics and multistate-problem TO also implies special considerations related to computational efficiency and high performance computing. Simple designs should be 3D printed for visualization and experimental verification of performance. (AU)

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