Electromigration and 4D microtomography in Sn-Bi-In thermal joints
Evaluation of alloys for thermal interface contact and for additive manufacturing
Microstructural Evolution in the Transient Solidification of Monophasic and Perite...
Microstructural evolution in the transient solidification of monophasic and perite...
Assessing thermal and microstructural parameters of the Sn-40wt%Bi-2wt%Ag solder a...
Mechanical properties and microstruture of directionally solidified Sn-Ag-Cu solde...
Experimental development of microstructure, microsegregation and tensile mechanica...