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Microstructural evolution in the transient solidification of monophasic and peritectic Sn-Sb solder alloys (and Sn-Sb-X) and in solder/substrate interfacial layers

Grant number: 13/09267-0
Support Opportunities:Scholarships in Brazil - Doctorate
Effective date (Start): August 01, 2013
Effective date (End): October 31, 2016
Field of knowledge:Engineering - Materials and Metallurgical Engineering - Transformation Metallurgy
Principal Investigator:Amauri Garcia
Grantee:José Marcelino da Silva Dias Filho
Host Institution: Faculdade de Engenharia Mecânica (FEM). Universidade Estadual de Campinas (UNICAMP). Campinas , SP, Brazil
Associated scholarship(s):15/13565-1 - Microstructural Evolution in the Transient Solidification of Monophasic and Peritectic Sn-Sb Solder Alloys (and Sn-Sb-X) and in Solder/Substrate Interfacial Layers, BE.EP.DR


Some particular metallic systems, which are characterized by invariant reactions such as eutectics, monotectics and peritectics, have been frequently investigated by the variety of microstructures that can be formed during solidification giving rise to increasingly practical applications of such alloys. With recent restrictions to the use of Pb in solder alloys, due to its toxicity, the search for alternative alloys to replace solders having Pb in their composition has increased. New compositions based on eutectic systems are being proposed with a view to replacing the classical Sn-Pb alloys, and even some peritectic compositions are being considered as potential interesting candidates. Despite the potential and interest of peritectic alloys, there is a limited comprehension of both peritectic transformation and reaction, which occur in a number of metallic binary systems. The literature gives indications that peritectic Sn-Sb alloys could be appropriate alternatives to Pb-based solders, but actually only the Sn5Sb alloy has been effectively investigated in spite of the range of potential compositions in the region of the peritectic point that deserve to be investigated, even by adding a third alloying element to their compositions. The present study aims to contribute to the investigations of lead-free solder alloys by developing a detailed analysis of the microstructural evolution of monophasic and peritectic Sn-Sb alloys as well as of ternary compositions Sn-Sb (Ag, Cu) during transient directional solidification, including the characterization of the phases forming the microstructure of solder/copper-substrate interfaces. The wettability, which is a fundamental feature of solder alloys, will be characterized for each alloy by experimental determination of the solder/substrate contact angle. Mechanical properties of the Sn-Sb alloys examined, as well as of the interfaces with copper substrates, will be determined by tensile and hardness tests. (AU)

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Scientific publications (9)
(References retrieved automatically from Web of Science and SciELO through information on FAPESP grants and their corresponding numbers as mentioned in the publications by the authors)
COSTA, THIAGO A.; FREITAS, EMMANUELLE S.; DIAS, MARCELINO; BRITO, CRYSTOPHER; CHEUNG, NOE; GARCIA, AMAURI. Monotectic Al-Bi-Sn alloys directionally solidified: Effects of Bi content, growth rate and cooling rate on the microstructural evolution and hardness. Journal of Alloys and Compounds, v. 653, p. 243-254, . (12/08494-0, 13/09267-0, 14/50502-5, 13/23396-7)
DIAS, MARCELINO; BRITO, CRYSTOPHER; BERTELLI, FELIPE; GARCIA, AMAURI. Cellular growth of single-phase Zn-Ag alloys unidirectionally solidified. Materials Chemistry and Physics, v. 143, n. 3, p. 895-899, . (12/08494-0, 13/09267-0, 12/16328-2)
COSTA, THIAGO A.; DIAS, MARCELINO; GOMES, LAERCIO G.; ROCHA, OTAVIO L.; GARCIA, AMAURI. Effect of solution time in T6 heat treatment on microstructure and hardness of a directionally solidified Al-Si-Cu alloy. Journal of Alloys and Compounds, v. 683, p. 485-494, . (13/23396-7, 13/09267-0, 14/50502-5)
DIAS, MARCELINO; BRITO, CRYSTOPHER; BERTELLI, FELIPE; ROCHA, OTAVIO L.; GARCIA, AMAURI. Interconnection of thermal parameters, microstructure, macrosegregation and microhardness of unidirectionally solidified Zn-rich Zn-Ag peritectic alloys. MATERIALS & DESIGN, v. 63, p. 848-855, . (12/08494-0, 13/09267-0, 12/16328-2)
JONAS DIAS FARIA; CRYSTOPHER CARDOSO DE BRITO; THIAGO ANTÔNIO PAIXÃO DE SOUSA COSTA; NATHÁLIA CAROLINA VERISSIMO; WASHINGTON LUIS REIS SANTOS; JOSÉ MARCELINO DA SILVA DIAS FILHO; AMAURI GARCIA; NOÉ CHEUNG. Influência na microestrutura e na microdureza decorrente da adição de 4%Ag na liga Al-4%Cu solidificada unidirecionalmente. MATERIA-RIO DE JANEIRO, v. 20, n. 4, p. 992-1007, . (13/09267-0, 13/23396-7, 12/08494-0)
DIAS, MARCELINO; COSTA, THIAGO; ROCHA, OTAVIO; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn-Sb lead-free solder alloys. MATERIALS CHARACTERIZATION, v. 106, p. 52-61, . (13/23396-7, 13/09267-0)
DIAS, MARCELINO; COSTA, THIAGO A.; SILVA, BISMARCK L.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys. MICROELECTRONICS RELIABILITY, v. 81, p. 150-158, . (17/15158-0, 13/09267-0, 16/18186-1)
DIAS, MARCELINO; COSTA, THIAGO A.; SOARES, THIAGO; SILVA, BISMARCK L.; CHEUNG, NOE; SPINELLI, JOSE E.; GARCIA, AMAURI. Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys. JOURNAL OF ELECTRONIC MATERIALS, v. 47, n. 2, p. 1647-1657, . (13/09267-0, 17/15158-0, 16/18186-1)
COSTA, T. A.; MOREIRA, A. L.; MOUTINHO, D. J.; DIAS, M.; FERREIRA, I. L.; SPINELLI, J. E.; ROCHA, O. L.; GARCIA, A.. Growth direction and Si alloying affecting directionally solidified structures of Al-Cu-Si alloys. MATERIALS SCIENCE AND TECHNOLOGY, v. 31, n. 9, p. 1103-1112, . (13/23396-7, 13/09267-0)
Academic Publications
(References retrieved automatically from State of São Paulo Research Institutions)
DIAS FILHO, José Marcelino da Silva. Unsteady and steady solidification of monophasic and peritectic Sn-Sb and Sn-Sb-(Ag,Cu) alloys: microstructural evolution, wettability and mechanical properties. 2016. Doctoral Thesis - Universidade Estadual de Campinas (UNICAMP). Faculdade de Engenharia Mecânica Campinas, SP.

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