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Microstructural analysis of Sn-Cu and Sn-Ag-Cu lead free solder alloys under fast and slow cooling

Abstract

Part of the interest on replacing traditional Pb-based alloys remains on developing rapidly solidified powders (>100 K/s) with special characteristics, such as low melting point and well-distributed intermetallics. The basis of the ongoing project with FAPESP is not rapid solidification. However, the usage of techniques as those available in University of Alberta for rapid solidification may improve understanding of new routes to produce suitable lead-free solder fillers. In many modern experimental techniques and industrial technologies related to casting and surfaces processing, the solidification step is critical in controlling the quality and performance of the final product. Indeed, mechanical properties of metallic alloy components are highly influenced by the complex phenomenon of solidification microstructures formation. The variation of different conditions of solidification (such as undercooling and cooling rate) gives a possibility to control the morphology and size of crystal structure, which substantially influence physical and chemical properties of alloys. The main activities previewed are: i. Powder production by Impulse Atomization (IA - Alberta); ii. Solidification of the alloys in Brazil using the DS technique; iii. Determination of cell/dendritic spacing, hardness, eutectic fraction and primary/eutectic undercooling measurements (Alberta and Brazil); iv. Comparisons between fast and slow cooling rate results (Alberta and Brazil). (AU)

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Scientific publications
(References retrieved automatically from Web of Science and SciELO through information on FAPESP grants and their corresponding numbers as mentioned in the publications by the authors)
MORENO, GUSTAVO R.; SILVA, BISMARCK L.; BOGNO, ABDOUL-AZIZ; HENEIN, HANI; SPINELLI, JOSE E.. Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys. Journal of Alloys and Compounds, v. 680, p. 259-267, . (13/50375-0)
BOGNO, ABDOUL-AZIZ; SPINELLI, JOSE EDUARDO; MOREIRA AFONSO, CONRADO RAMOS; HENEIN, HANI. Microstructural and mechanical properties analysis of extruded Sn-0.7Cu solder alloy. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 4, n. 1, p. 84-92, . (13/50375-0)

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